DirectCompress Soldering for 10% more contact surface compared to traditional soldering, and the more contact surface the faster the heat conduction.
Heatpipe Displacement Optimization allows for better and more evenly spread heat conduction on the fins compared to traditional linear alignment.
Jet Fin Acceleration System squeezes airflow and increases exhaust air speed. The increase of airflow speed in our Jet Fin Acceleration SystemTM allows heated air to leave the tower faster.
Heatpipe Convex-Align System allows for more heatpipes in a given area, optimized heatpipe placement in the copper base, and improved alignment with your CPU.
Includes two XF140 high precision low noise 140mm PWM fans.
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|Supported Sockets||AM2, AM2+, AM3, AM3+, AM4, FM1, FM2, FM2+, LGA1150, LGA1151, LGA1155, LGA1156, LGA1366, LGA2011, LGA2011-3, LGA2066, LGA775|
|Noise Level||23.0 dbA|
|Fan RPM||700 - 1300 RPM|