Kingston HyperX FURY 8GB (2x4GB) 2666Mhz DDR4 CL15 Review & Specs

Kingston HyperX FURY 8GB (2x4GB) 2666Mhz DDR4 Non-ECC CL15 HX426C15FBK2/8

Kingston HyperX FURY 8GB (2x4GB) 2666Mhz DDR4 Non-ECC CL15 HX426C15FBK2/8

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  • HyperX
  • HX426C15FBK2/8
  • is a kit of two 512M x 64-bit (4GB)
  • DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory
  • module, based on eight 512M x 8-bit FBGA components per
  • module.
  • Each module kit supports Intel® Extreme Memory
  • Profiles (Intel® XMP) 2.0.
  • Total kit capacity is 8GB. Each
  • module has been tested to run at DDR4-2666 at a low latency timing
  • of 15-17-17 at 1.2V.

Specifications Overview

Model HX426C15FBK2/8
Release Date August 2015

* First availability for purchase, it may not correspond to the actual market launch date.

Type 288-pin DIMM DDR4
Speed DDR4-2666MHz
Size 8GB (2 x 4GB)
CAS Latency 15
First Word Latency 11.25ns
Voltage 1.2V
Heat Spreader
ECC Support

RAM First Word Latency Table (nanoseconds)

Lower latency means faster memory.

Frequency (MHz)

2133 2400 2666 2800 2933 3000 3200 3300 3333 3400 3466 3600 3666 3733
13 12.19 10.83 9.75 9.29 8.86 8.67 8.13 7.88 7.80 7.65 7.50 7.22 7.09 6.96
14 13.13 11.67 10.50 10.00 9.55 9.33 8.75 8.48 8.40 8.24 8.08 7.78 7.64 7.50
15 14.06 12.50 11.25 10.71 10.23 10.00 9.38 9.09 9.00 8.82 8.66 8.33 8.18 8.04
16 15.00 13.33 12.00 11.43 10.91 10.67 10.00 9.70 9.60 9.41 9.23 8.89 8.73 8.57
17 15.94 14.17 12.75 12.14 11.59 11.33 10.63 10.30 10.20 10.00 9.81 9.44 9.27 9.11
18 16.88 15.00 13.50 12.86 12.27 12.00 11.25 10.91 10.80 10.59 10.39 10.00 9.82 9.64
19 17.82 15.83 14.25 13.57 12.96 12.67 11.88 11.52 11.40 11.18 10.96 10.56 10.37 10.18
20 18.75 16.67 15.00 14.29 13.64 13.33 12.50 12.12 12.00 11.76 11.54 11.11 10.91 10.72
21 19.69 17.50 15.75 15.00 14.32 14.00 13.13 12.73 12.60 12.35 12.12 11.67 11.46 11.25
22 20.63 18.33 16.50 15.71 15.00 14.67 13.75 13.33 13.20 12.94 12.69 12.22 12.00 11.79
23 21.57 19.17 17.25 16.43 15.68 15.33 14.38 13.94 13.80 13.53 13.27 12.78 12.55 12.32
24 22.50 20.00 18.00 17.14 16.37 16.00 15.00 14.55 14.40 14.12 13.85 13.33 13.09 12.86
25 23.44 20.83 18.75 17.86 17.05 16.67 15.63 15.15 15.00 14.71 14.43 13.89 13.64 13.39
CAS

Description

JEDEC/XMP TIMING PARAMETERS

JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V

DDR4-2400 CL14-16-16 @1.2V

DDR4-2133 CL12-14-14 @1.2V

XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• Height 1.340” (34.04mm), w/heatsink



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