- Phanteks
Clean interior -PSU Cover & HDDs. Tempered Glass window. Unique exterior design with integrated D-RGB Lighting. Integrated PSU cover
Fully Equipped with Magnetic Dust Filter. Long GPU Support (380mm/15in). Full Size PSU support. Equipped with 1x Phanteks 120mm Fans. Front I/O (2x USB 3.0, Headphone, Mic, D-RGB LED SW)
Integrated D-RGB Illumination modes + sync with D-RGB (addressable) motherboards/Phanteks D-RGB products. Optimized high-airflow design
2x Front Loaded 3.5" HDD. Supports up to 240/280mm radiator in front. 3x SSD mounting location (2x bracket included)
Motherboard Support: ATX, uATX, mITX, (E-ATX* - up to 285mm wide). Front I/O: 2x USB 3.0, Mic, Headphone, D-RGB LED SW. Side Window: Yes, Tempered Glass
In Stock
The Eclipse P350X is one of the latest cases from the American manufacturer Phanteks and it's available with tempered glass panel This model is almost perfect in any aspect, no matter whether you're looking at it from a build quality, a ventilation or a...
As we have mentioned, we were really impressed with the looks of the Eclipse P350X when we saw it at the Phanteks suite during CES 2018. We also know that things often change between the time you first see a product and when they become available....
| Model | PH-EC350PTG_DBK |
| Type | ATX Mid Tower |
| Color | Black |
| Includes Power Supply | |
| External 5.25" Drive Bays | 0 |
| External 3.5" Drive Bays | 0 |
| Internal 2.5" Drive Bays | 2 |
| Internal 3.5" Drive Bays | 2 |
| Motherboard Compatibility | ATX, Micro ATX, Mini ITX |
| Front Panel USB 3.0 Ports | |
| Dimensions | 455mm x 200mm x 450mm |
| Max GPU Length Allowance | 400.00mm |
Series: SX8200 Pro
Capacity: 512GB
Interface: M.2 (M)
NVME:
Form Factor: M.2-2280
SSD Controller: SMI
Max Sequential Read: Up to 3500 MB/s
Max Sequential Write: Up to 2300 MB/s
MTBF: 2,000,000 hours
Series: Ryzen 5
Core Name: Matisse
Socket: AM4
Integrated Graphics: None
CPU Cores: 6
CPU Threads: 12
CPU Clock Rate: 3600MHz
CPU Turbo Clock Rate: 4200MHz
TDP: 65W
CPU Cooler included:
Manufacturing Process: 7 nm
Maximum Supported Memory: 64GB
Cache L3: 16.00MB
Type: 288-pin DIMM
Speed: DDR4-3200MHz
Size: 16GB (2 x 8GB)
CAS Latency: 16
Voltage: 1.35V
Heat Spreader:
