Intel Core i3-7100

Intel Core i3-7100 3.9GHz Dual-Core LGA 1151 (BX80677I37100)

Intel Core i3-7100 3.9GHz Dual-Core LGA 1151 (BX80677I37100)

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  • Socket LGA 1151
  • Intel 200/1001 Series Chipset Compatibility (1. Excludes Intel Octane Technology support)
  • Intel HD Graphics 630

Specifications Overview

Model BX80677I37100
Release Date January 2017

* First availability for purchase, it may not correspond to the actual market launch date.

Series Core i3 7th Gen
Core Name Kaby Lake
Socket LGA1151
Integrated Graphics Intel HD Graphics 630
CPU Cores 2
CPU Threads 4
CPU Clock Rate 3900 MHz
CPU Turbo Clock Rate -
TDP 51 W
CPU Cooler included Yes
Manufacturing Process 14 nm
Maximum Supported Memory 64 GB
Cache L3 3 MB

Description

Essentials

Performance

  • # of Cores 2
  • # of Threads 4
  • Processor Base Frequency 3.90 GHz
  • Cache 3 MB SmartCache
  • Bus Speed 8 GT/s DMI3
  • # of QPI Links 0
  • TDP 51 W

Supplemental Information

  • Embedded Options Available No
  • Conflict Free Yes
  • Datasheet View now

Learn how Intel is pursuing conflict-free technology.

Memory Specifications

  • Max Memory Size (dependent on memory type) 64 GB
  • Memory Types DDR4-2133/2400, DDR3L-1333/1600 @ 1.35V
  • Max # of Memory Channels 2
  • ECC Memory Supported No

Graphics Specifications

  • Processor Graphics Intel® HD Graphics 630
  • Graphics Base Frequency 350.00 MHz
  • Graphics Max Dynamic Frequency 1.10 GHz
  • Graphics Video Max Memory 64 GB
  • 4K Support Yes, at 60Hz
  • Max Resolution (HDMI 1.4)‡ 4096x2304@24Hz
  • Max Resolution (DP)‡ 4096x2304@60Hz
  • Max Resolution (eDP - Integrated Flat Panel)‡ 4096x2304@60Hz
  • DirectX* Support 12
  • OpenGL* Support 4.4
  • Intel® Quick Sync Video Yes
  • Intel® InTru™ 3D Technology Yes
  • Intel® Clear Video HD Technology Yes
  • Intel® Clear Video Technology Yes
  • # of Displays Supported 3
  • Device ID 0x5912

Expansion Options

  • Scalability 1S Only
  • PCI Express Revision 3.0
  • PCI Express Configurations Up to 1x16, 2x8, 1x8+2x4
  • Max # of PCI Express Lanes 16

Package Specifications

  • Sockets Supported FCLGA1151
  • Max CPU Configuration 1
  • Thermal Solution Specification PCG 2015C (65W)
  • TJUNCTION 100°C
  • Package Size 37.5mm x 37.5mm
  • Low Halogen Options Available See MDDS

Advanced Technologies

  • Intel® Optane™ Memory Supported Yes
  • Intel® vPro Technology No
  • Intel® Hyper-Threading Technology Yes
  • Intel® Virtualization Technology (VT-x) Yes
  • Intel® Virtualization Technology for Directed I/O (VT-d) Yes
  • Intel® VT-x with Extended Page Tables (EPT) Yes
  • Intel® TSX-NI Yes
  • Intel® 64 Yes
  • Instruction Set 64-bit
  • Instruction Set Extensions SSE4.1/4.2, AVX 2.0
  • Idle States Yes
  • Enhanced Intel SpeedStep® Technology Yes
  • Thermal Monitoring Technologies Yes
  • Intel® Identity Protection Technology Yes
  • Intel® Stable Image Platform Program (SIPP) No

Intel® Data Protection Technology

  • Intel® AES New Instructions Yes
  • Secure Key Yes
  • Intel® Software Guard Extensions (Intel® SGX) Yes
  • Intel® Memory Protection Extensions (Intel® MPX) Yes

Intel® Platform Protection Technology

  • OS Guard Yes
  • Execute Disable Bit Yes
  • Intel® Device Protection Technology with Boot Guard Yes


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