Thermaltake TG-30 Thermal Compound

Thermaltake TG-30 Heatsink Thermal Compound 4g CL-O023-GROSGM-A

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Options (2)

	TG-7 $7.12
	TG-50 $20.99

[Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
[All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
[Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
[Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking

Info

Model	CL-O023-GROSGM-A
Release Date	September 2020 * First availability for purchase, it may not correspond to the actual market launch date.

	Old Name	Current Name	Branding	Data Speed	Port
USB 2.0	USB 2.0	USB 2.0	Hi-Speed USB	480 Mbit/s	diverse
USB 3.0	USB 3.1 Gen 1	USB 3.2 Gen 1x1	SuperSpeed USB	5 Gbit/s	diverse
USB 3.1	USB 3.1 Gen 2	USB 3.2 Gen 2x1	SuperSpeed USB 10Gbps	10 Gbit/s	diverse
USB 3.2	USB 3.2 Gen 2x2	USB 4.0 Gen 2x2	USB4 20Gbps	20 Gbit/s	only USB-C
USB4	USB 4.0 Gen 3x2	USB4 1.0	USB4 40Gbps	40 Gbit/s	only USB-C
USB4v2	USB 4.0 Gen 4	USB4 2.0	USB4 80Gbps	80-120 Gbit/s	only USB-C

Core Parts

Storage

Cooling

Peripherals

Audio

Networking

Other

Thermaltake TG-30

Thermaltake TG-30 Heatsink Thermal Compound 4g CL-O023-GROSGM-A

Options (2)

Info