Thermaltake TG-50

Thermaltake TG-50 Heatsink Thermal Compound 4g CL-O024-GROSGM-A

Thermaltake TG-50 Heatsink Thermal Compound 4g CL-O024-GROSGM-A

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  • [High Performance] Contains diamond powder for higher heat transfer providing a thermal conductivity of 8.0 W/m-k.
  • [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
  • [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
  • [Sustainability and Safety] The TG-50 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.
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Info

Model CL-O024-GROSGM-A
Release Date September 2020

* First availability for purchase, it may not correspond to the actual market launch date.


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